Upcoming Products
Lithography System
IEOA-MEBL K 250
Specifications:
Resolution
​Maximum Throughput
EPE
Field Size
Wafer Size
​
45-10 nm
​15 wph​
4 nm
Custom
100-300 mm
Description 

Introducing Integrated Emission and Optics Array - Multi Electron Beam Lithography (IEOA-MEBL) K 250, a cutting-edge multi-electron beam lithography system that boasts multiple 5keV e beams and the innovative IEOA writing module technology, achieving an impressive 10 nm resolution. This dual-stage tool is highly efficient, capable of performing alignment measurements and imaging simultaneously.
With versatile options for applications such as custom chip manufacturing and custom die sizes, IEOA-MEBL is expected to launch in the next four years and will be available for both and low volume production.
IEOA-MEBL 81X 5000
Specifications:
Resolution
​Maximum Throughput
EPE
Field Size
Wafer Size
​
5 nm
​180 wph​
1 nm
Custom
300 mm
Description 

The Integrated Emission and Optics Array - Multi Electron Beam Lithography (IEOA-MEBL) 81X 5000 is a-of-the-art lithography tool that has been specifically engineered to cater to high volume production requirements while also offering custom die size capabilities beyond A2 nodes.
If you're looking to take your to the next level, the IEOA-MEBL 81X 5000 is the perfect solution for you.
Mask Writer
IEOA-MEMW 760
Specifications:
Resolution
​Maximum Throughput
Mask Size
​
14 nm
2 masks/hr​​
Custom
(Upto 6 inch)
Description 

Integrated Emission and Optics Array - Multi Electron Mask Writer (IEOA-MEMW) 760 is a state-of-art mask writer that utilizes innovative IEOA writing module technology to produce high-quality 6-inch photomasks. With a throughput of up to 2 masks per hour for critical layers. Our cutting-edge technology offers a much faster solution compared to contemporary mask writers that can take 8+ hours to produce a single mask. So if you're looking for a time and reliable solution for your manufacturing needs, IEOA-MEMW is the perfect choice.